深圳市亿维天地电子设备有限公司
产品介绍
■ 全机为无铅工艺设计
■ 外形流线型,内部模块化设计,适合SMT及直插元件的无铅焊接
■ 调角采用手动方式,入端出口,独立可调,蜗轮蜗杆结构,省力易调
■ 配备自动洗爪装置
■ 锡炉锡道及叶轮采用铸造结构永不变形,耐磨损,耐腐蚀
■ 热补偿装置,可实现PCB在进入锡炉前温度下降范围≤2℃,减小热冲击
■ 双波均采用无级变频技术,可独立控制波峰高度
product description
■ The whole machine is lead-free process design
■ Outline streamlined, internal modular design, suitable for SMT and lead-in components lead-free soldering
■ Adjust the angle of the use of manual mode, the end of exports, independent adjustable, worm gear structure, easy to adjust
■ equipped with automatic claw device
■ tin furnace tin and impeller with casting structure is never deformed, wear-resistant, corrosion-resistant
■ thermal compensation device, can be achieved in the PCB into the tin before the temperature drop range ≤ 2 ℃, reduce the thermal shock
■ Dual wave are used stepless frequency conversion technology, can independently control the peak height
技术参数:
P C Borad width | 基板宽度 | Max250mm |
PCB conveyor height | PCB运输高度 | 750±20mm |
PCB conveyor speed | PCB运输速度 | 0-1.8m/min |
Preheating length | 预热区长度 | 800mm |
Preheating zones number | 预热区数量 | 1 |
Preheating Temperatures | 预热区温度 | 室温~350度 |
Suitable solder type | 适用焊料类型 | 普通/无铅焊料 |
Preheating capacity | 预热功率 | 5KW 可选 |
Wave solder pot | 波峰焊锡炉 | 8KW |
Crest value of solder waves | 波峰高度 | Max 10mm(冲击波可达30 mm) |
Solder volume | 锡熔量 | 165KG |
Solder temperature | 锡炉温度 | 室温~320度 |
Conveyor Angle | 焊接角度 | 3-7度 |
Temperature control | 控温方式 | PLC+PID |
Flux storage tank | 助焊剂容量 | Max5.2L |
Power requirements | 电源 | 3相5线制 380V 220V可选 |
Power for heating up | 启动功率 | 12KW |
Power for operation | 正常运行功率 | MAX 5KW |
Air supply | 气源 | 4-7kg/cm2 12.5L/min |
Weight | 重量 | Max 600kg |
Dimensions | 外形尺寸 | L2400*W1150*H1500 |