陶氏低密度聚乙烯 352E
Low Density Polyethylene Resin
产品说明:
DOW LDPE 352E Low Density Polyethylene Resin is a high clarity resin designed for clarity over wrap applications. This resin does contain erucamide slip and antiblock additives. It can be readily extruded using conventional blown film techniques utilising melt temperatures between 160 and 175 °C.
This resin when properly fabricated exhibits:
- Excellent processability and draw drown.
- Outstanding toughness and impact properties.
- Superior optical properties.
- Excellent tensile and tear strength.
Applications:
- Good optical general purpose bags.
Complies with:
- CANADIAN HPFB NO OBJECTION (WITH LIMITATIONS)
- U.S. FDA 21 CFR 177.1520(c)2.2
Consult the regulations for complete details.
基本信息 |
|
添加剂 |
|
机构评级 |
- FDA 21 CFR 177.1520
- HPFB (加拿大) No Objection
- 欧洲 No 10/2011
|
形式 |
|
物理性能 |
额定值 |
单位制 |
测试方法 |
比重 |
0.925 |
g/cm3 |
ASTM D792 |
熔流率(熔体流动速率)(190°C/2.16 kg) |
2.0 |
g/10 min |
ISO 1133 |
机械性能 |
额定值 |
单位制 |
测试方法 |
摩擦系数(与自身 - 动态) |
0.15 到 0.20 |
|
ASTM D1894 |
薄膜 |
额定值 |
单位制 |
测试方法 |
薄膜厚度 - 经测试 |
50 |
μm |
|
割线模量 |
|
|
ASTM D882 |
2% 正割, MD : 50 μm |
190 |
MPa |
ASTM D882 |
2% 正割, TD : 50 μm |
210 |
MPa |
ASTM D882 |
抗张强度 |
|
|
ASTM D882 |
MD : 屈服, 50 μm |
10.0 |
MPa |
ASTM D882 |
TD : 屈服, 50 μm |
11.0 |
MPa |
ASTM D882 |
MD : 断裂, 50 μm |
22.0 |
MPa |
ASTM D882 |
TD : 断裂, 50 μm |
20.0 |
MPa |
ASTM D882 |
伸长率 |
|
|
ASTM D882 |
MD : 断裂, 50 μm |
450 |
% |
ASTM D882 |
TD : 断裂, 50 μm |
650 |
% |
ASTM D882 |
落锤冲击(50 μm) |
110 |
g |
ASTM D1709A |
埃尔曼多夫抗撕强度 |
|
|
ASTM D1922 |
MD : 50 μm |
450 |
g |
ASTM D1922 |
TD : 50 μm |
350 |
g |
ASTM D1922 |
热性能 |
额定值 |
单位制 |
测试方法 |
维卡软化温度 |
96.0 |
°C |
ISO 306/A |
光学性能 |
额定值 |
单位制 |
测试方法 |
光泽度(20°, 50.0 μm) |
60 |
|
ASTM D2457 |
雾度(50.0 μm) |
8.0 |
% |
ASTM D1003 |
挤出 |
额定值 |
单位制 |
|
熔体温度 |
160 到 175 |
°C |
|