TECHNOMELT AS 8998
TECHNOMELT AS 8998 Slightly yellow
Features and Benefits:
NOURDETECHNOMELT AS 8998, Hot Melt Polyolefin, Masking
TECHNOMELT? AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal
coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is compatible with most
conformal coating materials in the industry.
- - Halogen free
- - Silicone free
- - Easily peelable without residues
- - RoHS compliant
NOURDETECHNOMELT AS 8998 is an advanced and efficient approach to
temporary masking techniques for conformal coating processes.
An alternative to manual taping methods, TECHNOMELT AS 8998 is a
hot melt adhesive that can be precisely applied to keep-out areas via
automated dispensing systems, reducing process time and labor costs.
The material is compatible with conformal coating chemistries, delivers
better control during thermal cure and releases cleanly from various
substrate surfaces.
nourde low pressure molding material solutions
Product Benefits
- Ultra-fast processing and solidification time
- Easily peelable
- Slump-resistant for improved dispense control
- Reduced labor and material cost
- Halogen-free and RoHS compliant
- No outgassing during coating process
- Can be dispensed automatically
- Compatible with Henkel conformal coatings
nourde low pressure molding material solutions
Technology : Hot Melt Polyolefin
Appearance : Slightly yellow
Dispense Method : Hot melt
Product Benefits:
- Silicone free
- Halogen free
- RoHS compliant
- Easily peelable without residues
- Zero outgassing @ 100 ℃
- Ultra fast process time
- 100% Solids material
- Solidifies upon cooling, no additional curing process required
- Good resistance to conformal coating ingression
Application : Masking
Cure : Physical setting
Softening Point, ℃ 100
Melting Viscosity @ 163℃, mPa.s (cP) 3,450
Hardness Shore 10A
Elongation, at break, 733%
Application Temperature: 150 to 180℃
NOURDE TECHNOMELT AS 8998、热熔聚烯烃,遮蔽
推荐将 TECHNOMELT AS 8998 可剥离热熔粘合剂用于在电路板涂覆涂层前遮盖需要保护的区域。最高到100℃ ,附着力不会降级。TECHNOMELT AS 8998 与业内
大多数电路板保护材料相兼容。
·Halogen free
·Silicone free
·Easily peelable without residues
·RoHS compliant
TECHNOMELT AS 8998
Technology Overview技术概述
如需TDS(Technical Data Sheets), SDS(Safety Data Sheets), RoHS(RoHS Data Sheets)…等资料或申请样品,请联系我们。
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