JSW Thermal Bonding Film 615S is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good

Note: Appropriate application equipment can enhance bonding film performance.

for the user’s evaluation in light of the user’s particular purpose and method of application.

The type of equipment used to JSW Thermal Bonding Film (TBF) 615 will depend on the application and on the

type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator

where heat and pressure can be varied to suit the application. Larger, thicker substrates can be JSW Thermal Bonding Film 615 bonded using a heated

static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or

three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding the user chooses, the user should determine the optimum

bonding conditions using the specific substrates involveOne approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series

and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures.

Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,

cooling the bondline below 93°C (200°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.

For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables

can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for

the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should

develop a similar table using the specific substrates involved. d.

Unless an additional warranty is specifically stated on the applicable JSW Thermal Bonding Film 615 product packaging or product literature,

CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY

IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED

WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the 3M product

does not conform to this warranty, then the sole and exclusive remedy is, at JSW Thermal Bonding Film 615s option, replacement of the JSW Thermal Bonding Film 615 product

or refund of the purchase price.

adhesion to a variety of substrates. The bonding film is supplied on a release coated paper liner. JSW 615 Thermal Bonding Film 615S contains,a non-woven scrim reinforcing web that improves handling of the film, and reduces flow of the adhesive during bonding.

of bonding temperatures, for example 121, 135, 149, 163 and 177°C (250, 275, 300, 325 and even 350°F). Time and JSW Thermal Bonding Film 615

pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates

JSW hot melt adhesive The shell is bonded to a hot melt film. . This hot melt has a long opening time and extremely high heat resistance, and is available in a variety of sizes to meet your specific production needs. For The shell is bonded to a hot melt filmpolypropylene and other LSE plastics have good adhesion jsw hot melt adhesive has good heat resistance, fuel resistance and oil resistance, and has adjustable and

positioned opening time. It can be used with a variety of surfaces such as furniture, automotive interiors, outdoor applications and small appliances. The shell is bonded to a hot melt filmand can be used in wood and lightweight metal bonding. Its 50-second opening time is sufficient for positioning and tuning, and supports the efficient production of many applications. The shell is bonded to a hot melt film. The shell is bonded to a hot melt film. The shell is bonded to a hot melt film. The shell is bonded to a hot melt film. Low temperature hot melt adhesive is suitable for the environment of 250°F/121°C. It is the ideal material for bonding electronics, plastics, cloth and other thermal sensitive materials. The shell is bonded to a hot melt film. 380°F/193°C. Using a JSW hot melt applicator, the melted adhesive is extruded from the nozzle by pneumatic pressure, a mechanical trigger mechanism, or pressure applied directly to the adhesive. Different nozzles can be used to apply thin, wide strips or narrow, thicknesses.

.The shell is bonded to a hot melt film. Hot melt film generally sets very quickly, from a few seconds to a few minutes, depending on the formula of the adhesive. And the speed of use and the temperature of the glue gun. Surface Understanding of Taiwanese brands through science and innovation, at our JSW Industrial Adhesives and Tape Division, we apply The science of bonding The shell is bonded to a hot melt filmblend to provide innovative solutions that improve the design and manufacturing processes of

companies around the world. Finally, our technology helps customers like you deliver competitive products to market faster and more efficiently. Category of Use: Tape, Adhesive, Material: Glue, Adhesive, Applicator, Manufacturer: JSW series, ,the shell is bonded to a hot melt film, Stored/cooled at 120°F(49°C) or below, . The details are as follows: Provides extreme temperature stability of 300 °F / 149 °C, a durable bond that is resistant to fuel, oil and shock, and a versatile adhesive for a variety of substrates.