JSW Thermal Bonding Film 615S is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good

Note: Appropriate application equipment can enhance bonding film performance.

for the user’s evaluation in light of the user’s particular purpose and method of application.

The type of equipment used to JSW Thermal Bonding Film (TBF) 615 will depend on the application and on the

type of equipment available for the user. Thin films and flexible substrates can be bonded using a heated roll laminator

where heat and pressure can be varied to suit the application. Larger, thicker substrates can be JSW Thermal Bonding Film 615 bonded using a heated

static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or

three-dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding the user chooses, the user should determine the optimum

bonding conditions using the specific substrates involveOne approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series

and more difficult to bond surfaces will require longer times, higher pressures and higher temperatures.

Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,

cooling the bondline below 93°C (200°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.

For reference, the following tables show typical bond strengths for bonds made at various temperatures. Such tables

can be used to evaluate optimum bondline temperatures. It is very important to note that this table is valid only for

the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should

develop a similar table using the specific substrates involved. d.

Unless an additional warranty is specifically stated on the applicable JSW Thermal Bonding Film 615 product packaging or product literature,

CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY

IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED

WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the 3M product

does not conform to this warranty, then the sole and exclusive remedy is, at JSW Thermal Bonding Film 615s option, replacement of the JSW Thermal Bonding Film 615 product

or refund of the purchase price.

adhesion to a variety of substrates. The bonding film is supplied on a release coated paper liner. JSW 615 Thermal Bonding Film 615S contains,a non-woven scrim reinforcing web that improves handling of the film, and reduces flow of the adhesive during bonding.

of bonding temperatures, for example 121, 135, 149, 163 and 177°C (250, 275, 300, 325 and even 350°F). Time and JSW Thermal Bonding Film 615

pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates

For supporting use, please refer to the bottom of the container for shipping information, shelf life starting date of shipment, shelf life of 24 months, storage/refrigeration temperature of 120°F(49°C) or below, details are as follows: Bonding Film 615offers a long-lasting bond with extreme temperature stability of 300oF / 149oC, resistance to fuel, oil, and shock, a versatile adhesive suitable for a variety of substrates, including most plastics, and a quick setting that allows for fast assembly, Bonding Film 615is suitable for electronic and plastic parts as well as cloth and wood.

Bonding Film 615is stronger than low-temperature . The melted adhesive is extruded through a nozzle which uses a JSW hot melt applicator and is extruded through pneumatic pressure, a mechanical trigger mechanism, or pressure directly applied to the adhesive. Different nozzles can be used to apply thin, wide strips or narrow, thick beads. Bonding Film 615sets quickly but can not be mixed to use less waste, because the water used adhesive is not enough, online directory hot Bonding Film 615fusion connection series, we apply the science of adhesive to provide innovative

solutions, Improve the design and manufacturing processes ofBonding Film 615companies around the world. Finally, our technology helps customers like you deliver competitive products to market faster and more efficiently, plus this hot melt adhesive is very stable at high temperatures (300°F). Synthetic polymer resin resin particle weight is low, can make the adhesive or synthetic purity is high, so can be used in the specific Bonding Film 615 conditions for cutting,

capsule and repair wood or drilling. The r0 has been proven in electronic and electric applications to speed up work with a hot super glue that produces less waste because of the unused slime inside the gun. Bonding Film 615can be used for cutting in specific situations because of the low weight of the resin particles, which can make the bonding agent or synthesis pure.