1.名称
BERGQUIST GAP PAD VO ULTRA SOFT/AC
导热胶模切加工成形
2.介绍
Ultra Conformable,Thermally Conductive Material for Filling Air Gaps.
.Thermal conductivity:1.0W/m-k
.Highly conformable,low hardness
."Gel-like"modulus
.Decreased strain
.Puncture,shear and tear resistant
.Electrically isolating
3.常规参数
4.用途及应用
Typical applications include:
.Telecommunications
.Computer and peripherals
.Power conversion
.Between heat-generating semiconductors or magnetic components and a heat sink
.Area where heat needs to be transferred to a frame,chassis,or other type of heat spreader
典型应用包括:
.电信
.计算机和外设
. 电力转换
.发热半导体或磁性部件与散热器之间
.需要将热量传递到框架,底盘或其他类型的散热器的区域
5.实物图拍摄
原材料实拍图1.
背胶模切成品图:
原材料正面图:
背胶模切正反图1:
背胶模切正反图2:
Bergquist Thermal
6.备注
特殊型号需要提前备料,欢迎来电咨询.
7.我们的优势及售后服务