THERMELT 865 Black

POLYAMIDE HOT MELT RESIN

优异耐寒特性（-50℃），流动性出色，加强附着力。

Copolymer polyamide hot melt resin

non reactive and solvent free, specially designed for Low Pressure Molding applications. THERMELT 865 is mainly used for molding of electronic/electric components, connectors and cables.

nourde polyamide low pressure molding

KEY FEATURES

- Excellent adhesion

- Good brittleness resistance at low temperature

- Flammability UL94 : V0

(UL file E116659)

品牌型号：bostik thermelt 865

基本组成：Polyamide聚酰胺

外观颜色：Natural / Black

技术应用：低压注塑成型

熔胶温度：190 to 210

断裂延伸率：200%

软化点：149 to 165

硬度：31D

耐温：-55 to120

阻燃：UL94-V0

产地：France法国

DESCRIPTION

nourde THERMELT 865 black is a pure copolymer polyamide hot

melt resin, non reactive and solvent free, specially

designed for Low Pressure Molding applications.

nourde low pressure molding material solutions.

APPLICATIONS

nourde THERMELT 865 is mainly used for molding of

electronic/electric components, connectors and cables.

Viscosity Brookfield

(210℃, SC4, 50 RPM) [Pa.s] 2.5-3.5

Softening point [℃] 149-165

Water content [%] 0.2

Yield strength

(50 mm/min, 23℃) [MPa] 2.8 ISO 527

Elongation at break

(50 mm/min, 23℃) [%] 200 ISO 527

Commercial shape Pellets

Packaging 20Kg bag

Glass transition

(DSC) [℃] - 50 Bostik

Strength at break

(50 mm/min, 23℃) [MPa] 3.0 ISO 527

Density ~1 Internal test

Water absorption

(immersed, 23℃) [%] 3,0 ISO 62

Hardness [Shore D]

(23℃) 31 ISO 868

ELECTRICAL PROPERTIES

Transversal

resistivity

(500V)

[Ω.cm] 2,8.10×11 IEC 60093

nourde low pressure molding material solutions

Dielectric rigidity

(23℃) [kV.mm-1] 18 IEC 60243-1

Relative permittivity

(50Hz, 23℃) [F.m-1] 5.7 IEC 60250

Melt Temperature Range [℃] 190-210

Mold Temperature Range [℃] 20-60

Drying Time

(Air oven, thin layer) [h] 8

Drying Temperature [℃] 70

Processing Moisture Content [%] 0.2

如需TDS（Technical Data Sheets）, SDS（Safety Data Sheets）, RoHS（RoHS Data Sheets）…等资料或申请样品，请联系我们。

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