The TECHNOMELT^? and LOCTITE^?

Low Pressure Molding Process

It"s really simple, because you are able to encapsulate your electronic products in only three steps:

1. Insert bare electronics into your predesigned mold set
2. Henkel encapsulates electronics at low pressure and temperatures
3. Test parts and move them to final assembly — immediately after molding

Do you have questions about the Henkelline of low pressure molding materials?Contacta member of a team today and we will be happy to assist you. We offer specialized services for all low pressure molding systems and our team of experts are able to assist you with all your questions.

How does low pressure molding fit to traditional manufacturing methods, such as injection molding and potting? It is similar to plastic injection molding but operating at a lower pressure, which makes this manufacturing method perfect for electronic components. Compared to Potting, low pressure molding reduces manufacturing times significantly and less cleaning requirements are needed.

Low Pressure Molding Materials

Henkel low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications. Our low pressure molding compounds include thermoplastic polyamides and polyolefinhot melt adhesivessuitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. Henkelis a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation. This also constitutes a sustainable solution through its unique re-usable formulation and green chemistry. Integrating Henkellow pressure molding compounds as an alternative to potting also reduces part numbers by eliminating the need for housing or additional parts to achieve strain relief.

Success stories with TECHNOMELT^? and LOCTITE^?low pressure molding

Aselectronic devicemanufacturers continue to move toward more cost-effective and sustainable solutions, TECHNOMELT?integration for viable protection of electronic components and systems is accelerating. Today, Henkel low pressure materials are used in a wide range of applications as for plugs and connectors, cable bunding, control units, monitors, sensors and many more. One example of where TECHNOMELT? was used is the recent lighting enhancement on a bridge in a major US city.TECHNOMELT? was used to encase 25,000 LED circuit boards, protecting the sensitive LED electronics from the harsh geographic environment.

TECHNOMELT?also was chosen to protect electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill in the Gulf of Mexico.TECHNOMELT? can be found in these high-visibility applications, as well as in products like coffee makers, self-driving cars, GPS tracking devices, and PC accessories.Find out more about the different industries and applications that use low pressure molding compounds:

Low Pressure Molding低压注塑 | 低压注塑材料

Protect electronics in three simple steps with sustainable, cost-effective TECHNOMELTmaterials.

TECHNOMELT PCB电路保护解决方案

Examples of Low Pressure Molding

TECHNOMELT现代PCB电路保护解决方案 汉高知名的TECHNOMET低压注塑解决方案是现代PCB和电路保护的基准。简便是TECHNOMELT的优势所在：因为整个操作在低压下进行，周期时间短，精密或易碎的电路板不会被损坏，相较于传统灌封或包封工艺有着巨大的进步。 汉高的低压注塑解决方案可提供卓越的密封粘合性以及优异的耐高温性和耐溶剂性。TECHNOMELT产品系列保护电子产品免受最恶劣的环境条件影响，包括高湿度、长期紫外线照射和极端冷热循环。

低压注塑技术 低压注塑是比传统的灌封更快和更有效的过程。TECHNOMELT 是一种单组分材料，无需混合或固化；通过流线型、多层次、轮廓精确的封装降低材料消耗；并通过独特的可重复使用配方和绿色化学应用提供可持续解决方案。结合TECHNOMELT材料作为灌封的替代方法，还可以通过消除对外壳或其他零件的需求来减少部件数量，从而消除应力影响。 好处 汉高TECHNOMELT产品系列为您的制造带来许多好处： 减少了过程环节 减少设备和操作占地面积 缩短了每个步骤的循环时间 减少了机器和生产线 低粘度材料可以降低注入压力

汉高的TECHNOMEL 是热熔胶的主要选择，旨在为客户的生产流程和成品提供最佳效果。

The TECHNOMELT and LOCTITE Low Pressure Molding Process

它的工作原理是怎样的？

Hot melt adhesivesare designed for a variety of applications where simplified processing, streamlined manufacturing and end-product protection are needed. Henkel’s TECHNOMELT is the leading choice for hot melt adhesives designed for the best results in production processes and finished products.

Introduced in the 1960s, TECHNOMELT? adhesives are trusted for reliability, quality and proven results and widely used in markets as diverse as electronics, medical, automotive, personal hygiene, furniture and packaging. These products come in a full range of reactive and non-reactive hot melt solutions.

TECHNOMELT adhesives are designed for superior cost-in-use and efficiency. The product portfolio includes groundbreaking innovative from our low temperature hot melt adhesives and sustainable solutions to help build and improve your business. TECHNOMELT hot melt adhesives:

• Deliver excellent cost-performance ratio
• Offer easy and reliable application
• Utilize sustainable and bio-based formulations
• Meet global regulatory compliance and product requirements

The Process

如何用TECHNOMELT进行低压注塑？ 这非常简单，因为只需三步就可以包封电子产品：

How does low pressure molding with TECHNOMELwork? It"s really simple, because you are able to encapsulate your electronic products in only three steps:

Application Versatility

汽车电子产品 热稳定性 耐化学性 低吸湿性 易塑性 良好的附着力 耐环境性	照明/LED LED大批量制造 灵活的设计选项 光学透明材料 不透水 紫外线稳定 白色材质选项 对于强大的设计解决方案	工业部件/传感器 电子绝缘 防止外部接触 密封接头 消除应变 抗振动和耐腐蚀 防水 最大程度减少户外暴露的影响

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Protection of Circuitry
Versatile protection for electronic devices

The TECHNOMELT portfolio is diverse and versatile, available in a wide variety of formulations and colors for application and market flexibility. All TECHNOMELT materials provide watertight encapsulation, strong adhesion to multiple substrates, resistance to various environmental conditions, low viscosity, high dielectric strength and flexibility at low temperature. The naturally-occurring raw materials maintain a wide operating temperature range (-40°C to 170°C), are UL approved and are available in customizable color options.

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Models	Color	Elongation	Hardness	Softening Point	Viscosity
PA6208N	Amber	600%	82 A	150 to 160 °C	3,600 cP @ 210 °C
PA6208S	Black	450%	82 A	150 to 160 °C	3,600 cP @ 210 °C
PA633	Amber	400%	90 A	170 to 180 °C	3,500 cP @ 210 °C
PA638	Black	400%	90 A	170 to 180 °C	3,500 cP @ 210 °C
PA641	Amber	400%	92 A	170 to 180 °C	4,500 cP @ 210 °C
PA646	Black	800%	92 A	170 to 180 °C	4,500 cP @ 210 °C
PA652	Amber	400%	77 A	157 to 165 °C	4,000 cP @ 210 °C
PA657	Black	400%	77 A	157 to 165 °C	4,000 cP @ 210 °C
PA673	Amber	400%	88 A	150 to 160 °C	3,400 cP @ 210 °C
PA678	Black	400%	88 A	150 to 160 °C	3,400 cP @ 210 °C
PA668	White	600%	90 A	155 °C	5,500 cP @ 210 °C

如需TDS（Technical Data Sheets）, SDS（Safety Data Sheets）, RoHS（RoHS Data Sheets）…等资料或申请样品，请联系我们。

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