商品 详情
CAVIST LOW PRESSURE MOLDING 低压注塑成型 Overmolded

¥ 20

  • ≥ 10000 起订量
  • 10000pcs 总供应
  • 广东 广州 所在地
广州言若德新材料科技有限公司
产品详情

LOW PRESSURE MOLDING 


low-pressure-molding-header - 750.jpg

Sealed, Rugged… Overmolded.


What is Low Pressure Molding 什么是低压成型?

Low Pressure Molding (LPM) is a slight variation from conventional injection molding. As the name would suggest, parts are molded at lower pressures, allowing for gentle encapsulation of delicate electronic assemblies.

[Unmolded] : Overmold : Cutaway


Unmolded : [Overmold] : Cutaway



Unmolded : Overmold : [Cutaway]


Why Low Pressure Molding 为什么要低压成型?

Conventional injection molding materials require processing temperatures and pressures that would damage a printed circuit board. Low Pressure Molding (LPM) uses thermoplastic materials with very low viscosity, allowing for overmolding and encapsulation of even the most sensitive circuit board assemblies. Because the materials are natural adhesives, the process is well-suited to sealing circuitry against dirt, dust and moisture…in many cases, up to an IP-68 rating.


A picture is worth a thousand words.



Electronics Overmolding Image Gallery

This mixture of images shows overmolded electronic components, cables, and cable assemblies. Select for more details.


Overmolded Smart Connector

Overmolded PCBA with Battery

Overmolded Stacked PCBA and Display

Overmolded Underwater Sensor

Sealed DB Connector with Ribbon Cable

Low Pressure Molded PCBA

Sealed Ethernet Connector

Overmolded Connector with PCBA

Overmolded Cable Jacket

Sealed 90 degree Connector

Sealed Connector and Cable

PCB with IP67 Encapsulation

2-Shot Overmolded PCBA (Top)

Custom DB Connector

Overmolded DB Connector Assembly

Overmolded Automotive ECU

Overmolded Cables

Overmolded USB Devices

2-Shot Overmolded PCBA (Bottom)

Overmolded Automotive Sensor

PCB with Sealed Connectors and Button

Mil-Spec Round Connector Overmold

Overmolded Large PCBA

Overmolded Outdoor Electronics

Custom Overmolded Eyewear PCBA

Custom Automotive Cable Assembly

Overmold for Wearable LEO Electronics

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